保存工作 返回搜索结果 职责描述 职位概要 类似职位 Shape the company's technology direction across 3D packaging Drive strategic programs that influence major customers, partnerships 关于我们的客户 Our client is a semiconductor OSAT company focused on developing advanced assembly and packaging solutions for global customers. 职责描述 Define the company's advanced packaging technology roadmap, covering 3D IC, TSV, hybrid bonding, advanced substrates, and chiplet integration. Lead R&D, engineering, and cross‑functional teams to develop new packaging platforms and manufacturing processes. Evaluate emerging technologies and drive feasibility studies, prototyping, and customer qualification programs. Partner with customers to understand product requirements and translate them into manufacturable technical solutions. Oversee technology transfer from R&D to high‑volume manufacturing, ensuring quality, reliability, and cost objectives are met. Maintain technical partnerships with foundries, substrate suppliers, equipment vendors, and research institutes. Develop and lead a senior engineering organization, including talent development, resource allocation, and succession planning. Provide technical input for business development, customer engagement, and long‑term strategic planning. 理想的求职者 Bachelor's degree in engineering; Master's or Ph.D. in Materials, Electrical Engineering, Microelectronics, Packaging, or related field preferred. 15+ years of experience in semiconductor packaging or OSAT, with significant exposure to 3D IC, TSV, hybrid bonding, or heterogeneous integration. Proven track record in technology development, advanced packaging platform ownership, or factory ramp‑up. Strong understanding of thermal, mechanical, electrical, and reliability considerations in advanced packages. Familiarity with HBM integration, logic‑memory stacking, chiplet architectures, and advanced substrate technologies. Experience managing large engineering teams and cross‑functional technical programs. Ability to engage directly with customers and external partners on technical and strategic topics. Strong communication, leadership, and decision‑making skills. 薪酬待遇 A senior executive role with broad influence over the company's technology direction and long‑term roadmap. Opportunity to build and scale advanced packaging capabilities that support major global semiconductor customers. Competitive compensation, performance incentives, and executive‑level benefits. 联系 Marcus Zhu 职位编号 JN-042026-6989102 联系电话 +86 21 6035 3505 职位概要 职位类别 高阶人才搜寻 子类别 工程与制造 行业 半导体 地区 中国 工作类型 全职 顾问名字 Marcus Zhu 顾问电话号码 +86 21 6035 3505 职位编号 JN-042026-6989102
