保存工作 返回搜索结果 职责描述 职位概要 类似职位 Take ownership of full‑chip architecture definition and drive complex SoC Work on advanced‑node communication SoCs with strong influence 关于我们的客户 Our client is a semiconductor design company focused on communication SoC development. 职责描述 Define overall chip architecture and technical framework, including system specifications and decomposition of performance, power, cost, and area targets; produce architecture documentation and technical proposals. Lead SoC‑level architecture design, including IP selection and integration, interface protocol definition, and timing constraint planning. Define hardware and software partitioning, including internal functional module design, driver architecture, and on‑chip firmware interaction to ensure system efficiency and scalability. Drive coordination across architecture design, verification, and front‑end/back‑end implementation, resolving key challenges related to timing, low power, and system integration. 理想的求职者 Master's degree or above in Communications, Microelectronics, Computer Engineering, or a related field. More than 10 years of experience in communication SoC architecture design (4G/5G), with at least three successful tape‑outs; hands‑on experience with 12 nm or more advanced process nodes is required. Proven experience managing full architecture cycles for two or more generations of mass‑produced chips, with delivery records. Strong capability in 12 nm SoC architecture design, with experience in DFT, STA, low‑power design, and physical implementation collaboration, as well as yield and production support. In‑depth knowledge of ARM, CEVA, AMBA, DDR, and high‑speed interfaces such as PCIe and SerDes; solid experience with NoC design and heterogeneous integration, including chiplet partitioning and implementation. Ability to define chip‑level verification strategies, promote front‑end and back‑end collaboration, resolve architecture‑level bottlenecks, and ensure testability and manufacturability. Experience with radiation‑tolerant design is a plus; familiarity with advanced packaging technologies is an advantage. Strong teamwork and communication skills, with the ability to proactively expand technical knowledge and deliver work effectively. 薪酬待遇 Competitive compensation aligned with senior technical responsibilities. Participation in advanced SoC architecture planning and long‑term product roadmaps. Collaboration with experienced cross‑functional engineering teams. Flexible working location options in Beijing, Wuhan, Xi'an, or Shanghai. 联系 Marcus Zhu 职位编号 JN-042026-7007318 联系电话 +86 21 6035 3505 职位概要 职位类别 工程与制造 子类别 集成电路设计/半导体 行业 半导体 地区 中国 工作类型 全职 顾问名字 Marcus Zhu 顾问电话号码 +86 21 6035 3505 职位编号 JN-042026-7007318
