Save Job Back to Search Job Description Summary Similar Jobs Take ownership of full‑chip architecture definition and drive complex SoC Work on advanced‑node communication SoCs with strong influence About Our Client Our client is a semiconductor design company focused on communication SoC development. Job Description Define overall chip architecture and technical framework, including system specifications and decomposition of performance, power, cost, and area targets; produce architecture documentation and technical proposals. Lead SoC‑level architecture design, including IP selection and integration, interface protocol definition, and timing constraint planning. Define hardware and software partitioning, including internal functional module design, driver architecture, and on‑chip firmware interaction to ensure system efficiency and scalability. Drive coordination across architecture design, verification, and front‑end/back‑end implementation, resolving key challenges related to timing, low power, and system integration. The Successful Applicant Master's degree or above in Communications, Microelectronics, Computer Engineering, or a related field. More than 10 years of experience in communication SoC architecture design (4G/5G), with at least three successful tape‑outs; hands‑on experience with 12 nm or more advanced process nodes is required. Proven experience managing full architecture cycles for two or more generations of mass‑produced chips, with delivery records. Strong capability in 12 nm SoC architecture design, with experience in DFT, STA, low‑power design, and physical implementation collaboration, as well as yield and production support. In‑depth knowledge of ARM, CEVA, AMBA, DDR, and high‑speed interfaces such as PCIe and SerDes; solid experience with NoC design and heterogeneous integration, including chiplet partitioning and implementation. Ability to define chip‑level verification strategies, promote front‑end and back‑end collaboration, resolve architecture‑level bottlenecks, and ensure testability and manufacturability. Experience with radiation‑tolerant design is a plus; familiarity with advanced packaging technologies is an advantage. Strong teamwork and communication skills, with the ability to proactively expand technical knowledge and deliver work effectively. What's on Offer Competitive compensation aligned with senior technical responsibilities. Participation in advanced SoC architecture planning and long‑term product roadmaps. Collaboration with experienced cross‑functional engineering teams. Flexible working location options in Beijing, Wuhan, Xi'an, or Shanghai. Contact Marcus Zhu Quote job ref JN-042026-7007318 Phone number +86 21 6035 3505 Job summary Function Engineering & Manufacturing Specialisation Integrated Circuit Design / Semiconductor What is your area of specialisation? Semiconductors Location China Contract type Permanent Consultant name Marcus Zhu Consultant phone +86 21 6035 3505 Job Reference JN-042026-7007318
