Save Job Back to Search Job Description Summary Similar Jobs Join a dynamic team at the forefront of semiconductor technology Contribute to innovative IGBT and SiC module designs About Our Client Our client is an international semiconductor IDM company, committed to advancing power electronics through cutting-edge research and development. Job Description Direct the research and development of IGBT modules, ensuring designs meet performance, reliability, and cost targets. Collaborate with cross-functional teams to integrate module designs into larger systems. Oversee the design and testing of new packaging concepts for IGBT and SiC modules. Monitor market trends and technological advancements to ensure our products remain competitive. Manage and mentor a team of engineers, fostering a culture of innovation and excellence. The Successful Applicant Degree in Electrical Engineering or a related field. Proven experience in semiconductor module packaging design, especially IGBT modules. Familiarity with SiC module design is preferred. Excellent leadership and project management skills. Ability to work effectively in a cross-cultural and international environment Proficiency in design and simulation software such as CAD tools and circuit simulation packages. What's on Offer Competitive salary and performance-based bonuses. Comprehensive benefits package including health insurance, retirement plans, and paid time off. Opportunity for professional growth and development Contact Marcus Zhu Quote job ref JN-122024-6623089 Phone number +86 21 6035 3505 Job summary Function Engineering & Manufacturing Specialisation Integrated Circuit Design / Semiconductor What is your area of specialisation? Industrial / Manufacturing Location Shanghai Contract type Permanent Consultant name Marcus Zhu Consultant phone +86 21 6035 3505 Job Reference JN-122024-6623089
