半导体职位招聘信息

• 负责公司合规体系建设与维护，跟踪法规变化，识别并防控合规风险，审核业务流程，组织培训，协助应对监管检查，确保企业运营合法合规。

1. 有机会在半导体设备领域中，深度参与金属研发的关键环节，对行业发展产生重要影响。
2. 能够领导一支专业团队，发挥自己的技术专长和管理能力，实现个人职业发展的新突破。

制定并执行区域销售战略，带领团队完成年度营收目标并持续提升市场份额。

本岗位为 A 股上市公司专职董事会秘书，全面负责公司信息披露、公司治理及资本市场沟通工作。岗位直接向董事长汇报，并对董事会负责，是公司在资本市场与监管层面的关键窗口。

半导体设备采购供应链总监将负责管理与优化采购和供应链流程，确保资源高效利用并支持公司业务目标的实现。此职位需要在半导体领域中具备专业知识和实践经验。

该职位负责制定并执行销售与市场战略，领导团队实现公司在高性能计算、存储及Chiplet相关领域的业务增长目标。

半导体危废处理设备销售总监负责推动公司在工业制造行业中的销售业绩，制定并执行销售战略以实现业务增长目标。

全面负责质量管理体系的规划与执行，涵盖客户质量、质量保证及质量控制，确保产品与服务符合行业与企业标准。

负责fab厂产线的日常运营管理，确保生产线的稳定高效运行，以满足客户需求并提高公司整体竞争力。

新增法务负责人岗位，支持公司上市，分管法务及知产。

The CIS Pixel Design Director will lead pixel architecture and design activities from concept through mass production, with responsibility for technical decisions and commercial readiness of CIS products.

This role leads the design, development, and commercialisation of photodiode technologies, including PD, APD, SPAD, and SiPM, from concept through product release.

负责半导体及光伏领域碳材料产品的市场拓展与客户管理，推动销售目标达成，并协同技术团队优化产品应用方案。

负责公司供应链及采购管理的整体规划与执行，确保供应链的高效运作，以满足多品种小批量的离散制造需求。

1.公司发展迅速，公司赛道好，公司的侧重研发 ，技术壁垒高。

2.公司的发展前景非常好，已经有成熟的产品和稳定的销售现金流。

The Fellow, Acoustic MEMS Devices will provide deep technical expertise in the design, validation, characterization, and process engineering of acoustic MEMS devices, supporting technology development, product readiness, and cross‑functional engineering decisions.

This role oversees the design, verification, and optimization of TIA‑focused analog IC circuits while guiding a technical team through the full development cycle.

This role is responsible for ensuring process reliability and robustness across advanced node logic IC manufacturing, driving improvements in yield and long-term performance.

As the Market Sales Manager, you will lead the team to achieve significant results in the Chinese market by accurately positioning the market and implementing efficient sales strategies to promote the widespread application of our products in the materials industry.

We are seeking an experienced R&D Director to lead the IGBT Module development, with a focus on module packaging design and ideally, familiarity with SiC module design.