Save Job Back to Search Job Description Summary Similar Jobs Shape the company's technology direction across 3D packaging Drive strategic programs that influence major customers, partnerships About Our Client Our client is a semiconductor OSAT company focused on developing advanced assembly and packaging solutions for global customers. Job Description Define the company's advanced packaging technology roadmap, covering 3D IC, TSV, hybrid bonding, advanced substrates, and chiplet integration. Lead R&D, engineering, and cross‑functional teams to develop new packaging platforms and manufacturing processes. Evaluate emerging technologies and drive feasibility studies, prototyping, and customer qualification programs. Partner with customers to understand product requirements and translate them into manufacturable technical solutions. Oversee technology transfer from R&D to high‑volume manufacturing, ensuring quality, reliability, and cost objectives are met. Maintain technical partnerships with foundries, substrate suppliers, equipment vendors, and research institutes. Develop and lead a senior engineering organization, including talent development, resource allocation, and succession planning. Provide technical input for business development, customer engagement, and long‑term strategic planning. The Successful Applicant Bachelor's degree in engineering; Master's or Ph.D. in Materials, Electrical Engineering, Microelectronics, Packaging, or related field preferred. 15+ years of experience in semiconductor packaging or OSAT, with significant exposure to 3D IC, TSV, hybrid bonding, or heterogeneous integration. Proven track record in technology development, advanced packaging platform ownership, or factory ramp‑up. Strong understanding of thermal, mechanical, electrical, and reliability considerations in advanced packages. Familiarity with HBM integration, logic‑memory stacking, chiplet architectures, and advanced substrate technologies. Experience managing large engineering teams and cross‑functional technical programs. Ability to engage directly with customers and external partners on technical and strategic topics. Strong communication, leadership, and decision‑making skills. What's on Offer A senior executive role with broad influence over the company's technology direction and long‑term roadmap. Opportunity to build and scale advanced packaging capabilities that support major global semiconductor customers. Competitive compensation, performance incentives, and executive‑level benefits. Contact Marcus Zhu Quote job ref JN-042026-6989102 Phone number +86 21 6035 3505 Job summary Function Executive Search Specialisation Engineering & Manufacturing What is your area of specialisation? Semiconductors Location China Contract type Permanent Consultant name Marcus Zhu Consultant phone +86 21 6035 3505 Job Reference JN-042026-6989102
