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Supplier Development Engineer
- Multicultural working environment
- Competitive remuneration
About Our Client
Our client is a multinational company with operation in Shenzhen. They are now looking for someone who has strong technical knowledge to join their fast growing team.
You will drive ASIC qualification according to corporate Mandated Requirements, and resolve defective/discrepant material issues. You need to analyze data, draw conclusions, and achieve production goals over the product development life-cycle by identifying and mitigating risks for manufacturing. For any failures in production, or in the field, the SDE will lead and drive failure analysis to determine root cause. Root cause will need to be confirmed with the supplier and correlated back to the failure. You will lead Quality meetings with suppliers to drive timely qualifications of new technologies as well as enforce the incoming/outgoing DPPM requirements. You need to participate in the development and improvement of indicators, systems and business processes to drive efficiencies. You need to develop IC qualification guidelines and similarity rules. Your responsibilities also include post qualification support of the product including exclusionary events and/or customer requests, as well as collaborating with engineering teams in order to provide feedback to suppliers for changes in design, validation or process to improve system and/or product reliability based on qualification learning.. You will travel domestically and internationally ~30-40%.
The Successful Applicant
Master degree, (PhD is preferred), you should have at least 7 years technical experience with ICs and ASICs. IC packaging and test experience a must. You should be familiar with 1st and 2nd level interconnect qualification procedures, and Design of Experiments and Statistical Process Control. Familiarity with RoHS compliant regulations is preferred. You should be a self-starter with a "can do" attitude, and willing to take game changing initiatives and see them to fruition with minimal supervision. You should have knowledge of Wafer fabrication and packaging processes. Good communication and presentation skills, both written and oral, are required. Adept at Statistical Analysis and proficient with JMP/MiniTab, and knowledge of Reliability Models, in particular Silicon-Package Interactions are required. Ability to Map Reliability Models with respect to Use Conditions, understanding of Lead Free Solders/Alloys and failure mechanisms can be a plus. Hands-on experience with SMT and PCBA is a big plus.
What's on Offer
Attractive salary package. Excellent career platform. Multi-culture working environment.